Revealed earlier this week, the Gigabyte X870E Aorus Infinity Next stands out from the crowd of AMD motherboards thanks to its use of aerospace-inspired thermal materials and 3D-printed cooling components. The flagship board also features a hefty 64-phase power design aimed at enthusiasts and overclockers. Unsurprisingly, the motherboard leads the company’s new Aorus Infinity lineup and forms part of Gigabyte’s 40th anniversary celebrations.
At the centre of the design is what Gigabyte calls its AI Gyroid M.2 heatsink, a structure made possible through 3D metal printing technology. According to a product manager that I spoke with, the design delivers “up to 44% more cooling surface area” compared to traditional heatsinks, allowing heat to dissipate more efficiently from high-performance PCIe 5.0 SSDs.
The motherboard also incorporates a 3D-printed vapour chamber alongside a honeycomb-structured metal backplate. Combined with what Gigabyte describes as rocket thruster-grade thermal materials, the cooling system is designed to handle the increasing thermal demands of modern processors, graphics cards and high-speed storage devices.
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