When we reviewed the Honor Magic V5 last year, we thought that it would be almost impossible for the next generation to get even thinner.
Well, the Honor Magic V6 has proved us wrong. Announced at MWC 2026, the 2026 Honor foldable is the Chinese brand’s thinnest model at 8.75mm folded, or 4.0mm unfolded. But that’s not all that is new with it.
Impossibly slim and even more durable
Honor Magic V6, folded.
Screenshot: HWZ (Honor livestream)
Equipped with the Qualcomm Snapdragon 8 Elite Gen 5, the Magic V6 will be one of the first foldables on the market with this new flagship processor.
Durability has been massively improved in this generation. Honor claimed 10x more drop resistance, 15x more scratch resistance and 3x more water resistance (the last one with the help of its IP68/69 rating). The hinge is made from new Honor Super Steel, which has a tensile strength of 2,800 MPa.
There’s also SGS certification up to 500,000 folds, with the new ultra-thin glass (UTG) layer on the main display reducing the main screen crease depth by 44%.
Stylus support on both displays for Magic V6.





