Bridge Data Centres plans to invest between $3 billion and $5 billion in Singapore and beyond to develop next-generation, AI-ready digital infrastructure.
The Singapore-headquartered digital infrastructure platform, backed by Bain Capital, is positioning the investment to support the rapid growth of artificial intelligence workloads and strengthen Singapore’s role as a regional hub for cloud computing and digital connectivity.
By anchoring its global headquarters in Singapore, Bridge Data Centres (BDC) is leveraging the country’s robust regulatory environment, strong connectivity ecosystem and strategic location to support hyperscale customers across Asia-Pacific.
The company already ranks among Asia-Pacific’s top hyperscale data centre developers, with campuses across Malaysia, Thailand and India, and is on track to expand its regional capacity to around 2 gigawatts (GW) by 2030.
As demand for artificial intelligence infrastructure accelerates across the region, such investments are expected to play an increasingly important role in enabling large-scale computing, cloud platforms and digital services.
Global partner at Bain Capital Drew Chen, speaking at Bridge Data Centres’ new brand identity launch event during the Pacific Telecommunications Council (PTC) 2026 conference in Honolulu, Hawaii.
PHOTO: BRIDGE DATA CENTRES
BDC is working with global technology partners, including Vertiv, Delta Electronics and Supermicro to develop advanced cooling and power systems designed to support high-density AI computing environments.
These collaborations focus on engineering advanced liquid cooling architectures, high-density GPU cooling systems and energy-optimised HVAC solutions, which are increasingly required to support AI-driven workloads.
BDC and Vertiv signed an agreement to explore advanced liquid cooling and scalable power solutions for high-density AI workloads.
PHOTO: BRIDGE DATA CENTRES
The company is also working with Terahop and Teracule, subsidiaries of Zhongji Innolight, to explore integrated solutions combining high-performance optical connectivity with next-generation liquid cooling technologies.





