Xiaomi 18 Fold makes its IFA 2026 debut with wide form factor and XRing O3 chip

Xiaomi 18 Fold makes its IFA 2026 debut with wide form factor and XRing O3 chip



Just weeks after Samsung unveiled the Galaxy Z Fold8, and less than a week before Apple is expected to reveal its first foldable iPhone, Xiaomi has showcased its own take on the increasingly popular wide-screen foldable at IFA 2026.

The Xiaomi 18 Fold was shown off at the company’s IFA booth in Berlin, but Xiaomi has not yet revealed its complete specifications. It has confirmed a few of the phone’s headline features ahead of its full launch in China on 7 September.

At the heart of the 18 Fold is Xiaomi’s new XRing O3 chipset. The company says the foldable will be its first flagship smartphone powered by the latest in-house silicon. The phone will also be one of the first smartphones to use ChangXin Memory Technologies’ next-generation LPDDR6 RAM, with memory speeds of up to 12.8Gbps.




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