Boku, a network for localised payment solutions, announced the launch of its Innovation Hub in Singapore on 12 November 2025 at the Singapore Fintech Festival. The hub includes a team focused on building new payment capabilities, which aims to solve merchants’ cross-border money movement challenges.
With global payments projected to reach about US$290 trillion by 2030, Boku is prioritising solutions that remove friction for global merchants. This includes real-time FX and payout capabilities and the application of AI and blockchain technologies with financial services.
Yi Hahn Chin, Head of Boku’s Innovation Hub, shared that cross-border payments remained one of the most persistent friction points for digital merchants operating across multiple markets. He added,
